Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board

ABSTRACT

A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.

TECHNICAL FIELD

The present invention relates to a method for producing athree-dimensional wiring board that is three-dimensionally molded, athree-dimensional wiring board produced by the production method, and asubstrate for a three-dimensional wiring board that is used in thethree-dimensional wiring board.

BACKGROUND ART

The conventionally known three-dimensional wiring boards include an MID(Molded Interconnect Device) substrate that is a component in which anelectric circuit is directly and three-dimensionally formed on a surfaceof a structural body having a three-dimensional structure. Processessuch as the two shot molding process, MIPTEC (Microscopic IntegratedProcessing Technology), and LDS (Laser Direct Structuring) are known astechnology that relates to MID substrates. In each of these processes,after forming mold resin into a three-dimensional structure, a wiringcircuit is formed on a surface thereof. For example, in Patent Document1, technology relating to an MID substrate and the production thereof isdisclosed.

In the two shot molding process, secondary molding is performed usingnew resin with respect to a portion which is not subjected to wiringformation on mold resin that underwent primary molding, and catalystapplication and plating is then performed using the resin relating tothe secondary molding as a resist to thereby form a wiring circuit onthe mold resin. However, because of limitations to the mold machiningprecision for the secondary molding in order to regulate a wiringpattern shape by means of the resin that is subjected to the secondarymolding, the minimum value for L/S (line width and spacing) thatindicates the conductor width and conductor spacing is of the order of150/150 μm, and formation of a finer wiring pattern has been difficult.

In MIPTEC, metallizing is performed with respect to the entire surfaceof the mold resin that was molded, and metal (a metallized layer) at anouter edge portion of the wiring circuit is removed by means of a laserbeam. Subsequently, electroplating is performed by passing an electriccurrent through a region that is to serve as a wiring circuit, andthereafter flash etching is performed with respect to the whole area ofthe molded body to remove metal other than the wiring circuit andthereby form the wiring circuit on the mold resin. However, in the caseof using a laser beam, a special laser irradiation apparatus thatcorresponds to the three-dimensional shape of the mold resin that wasmolded is required, and the time and labor required for laser machiningas well as an increase in the production cost that is caused byinvestment in plant and machinery is a problem. Further, since it isnecessary to pass a current through only a region that is to serve as awiring circuit in order to deposit metal that is required for the wiringcircuit by electroplating, it is necessary for the region that is toserve as the wiring circuit to be electrically connected to an outercircumferential portion of the molded body or to be electricallyconnected to the outer circumferential portion through a power feederline. That is, the problems arise that it is difficult to electricallyisolate the region that serves as the wiring circuit from the outercircumferential portion of the molded body (that is, to form anindependent wiring pattern), and that the costs increase accompanyingformation and removal of a power feeder line that is ultimately notrequired for the circuit.

In LDS, a wiring circuit is formed on mold resin by performing primarymolding using a special resin material that contains conductiveparticles, irradiating a laser beam onto a region that is to serve as awiring circuit to expose the conductive particles, and performingplating at a portion at which the conductive particles are exposed.However, because of a problem regarding the accuracy with whichconductive particles within the mold resin that was molded are exposed,the minimum value of the L/S is of the order of 100/150 μm, andformation of a finer wiring pattern has been difficult. Further,similarly to MIPTEC, a special laser irradiation apparatus is required,and the time and labor required for laser machining as well as anincrease in the production cost that is caused by investment in plantand machinery are problems.

Further, in each of the above described processes, because a wiringcircuit is formed on mold resin having a three-dimensional shape, theMID substrate that is ultimately produced is a single-sided substrate.Therefore, the problem arises that the degree of freedom with respect tothe wiring circuit is less when compared to a double-sided substrate,and miniaturization of the substrate is also difficult. As a method forsolving this problem and the problems described above, a method ofproducing a three-dimensional wiring board is available in which awiring circuit is formed on thermoplastic resin such as polyimide, andthereafter the resin is subjected to bending work by heating andpressurization. For example, Patent Document 2 discusses performingthree-dimensional molding after a metal foil is attached onto apolyimide film by thermocompression bonding, and Patent Document 3discusses performing three-dimensional molding after applying aconductive paste onto polysulfone resin.

PRIOR ART DOCUMENT Patent Document

Patent Document 1: Japanese Patent Laid-Open No. 2012-94605

Patent Document 2: Japanese Patent Laid-Open No. 6-188537

Patent Document 3: Japanese Patent Laid-Open No. 2000-174399

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

However, when it is attempted to bend and three-dimensionally moldthermoplastic resin that is flat by performing heating andpressurization, stretching occurs that is centered around a bentportion. At such time, although on one hand most thermoplastic resinshave a large breaking elongation and stretch comparatively freely, onthe other hand even though the metal which was subjected to patternformation stretches to a certain limit, if the metal stretches beyondthe limit a countless numbers of cracks that have a wide width aregenerated and the metal breaks. For example, if three-dimensionalmolding is performed after forming metal to serve as a wiring circuit onresin by a method as described in Patent Document 2 and Patent Document3, disconnection of a wire in the wiring circuit is liable to occur at acurved portion of the three-dimensional wiring board, and consequentlyit is difficult to produce a three-dimensional wiring board that hasexcellent reliability. In particular, in a case of molding athree-dimensional substrate having a complicated three-dimensional shapewith respect to which the amount of stretching is large, thedisconnection of a wire in a wiring circuit is even more liable tooccur.

The present invention has been made to solve the above describedproblems, and an object of the present invention is to provide aproduction method that achieves fine patterning of a wiring circuit anda reduction in cost, and enables production of a three-dimensionalwiring board that prevents disconnection of wires in a wiring circuitsand thus has excellent reliability. Further, the present invention hasbeen made to solve the above described problems, and an object thereofis to provide a three-dimensional wiring board with respect to whichfine patterning of a wiring circuit and a reduction in cost areachieved, and on which a wiring circuit is formed on one side or twosides thereof and which prevents disconnection of wires in a wiringcircuits and thus has excellent reliability, as well as a substrate fora three-dimensional wiring board that is used in the three-dimensionalwiring board.

Means for Solving the Problems

In order to achieve the above object, a three-dimensional wiring boardproduction method of the present invention includes: a preparation stepof preparing a resin film having a breaking elongation of 50% or more; afirst metal film formation step of forming a first metal film on asurface of the resin film; a pattern formation step of performingpatterning on the first metal film by photolithography to form a desiredpattern; a three-dimensional molding step of performingthree-dimensional molding by heating and pressurizing the resin film;and a second metal film formation step of forming a second metal film onthe first metal film having a pattern formed thereon; wherein, in thefirst metal film formation step, the first metal film is formed in aporous state by depositing a metal in a particle state and regulating afilm thickness.

Further, in order to achieve the above object, a three-dimensionalwiring board of the present invention includes: a resin film having athree-dimensional shape and having a breaking elongation of 50% or more;a first metal film that is formed on a surface of the resin film andthat has a desired pattern; and a second metal film that is formed onthe first metal film; wherein a film thickness of the first metal filmis regulated so that the first metal film is a porous-like structurethat is formed by depositing a metal in a particle state.

In addition, in order to achieve the above object, a substrate for athree-dimensional wiring board of the present invention includes: aresin film having a breaking elongation of 50% or more; and a firstmetal film that is formed on a surface of the resin film and that has adesired pattern; wherein a film thickness of the first metal film isregulated so that the first metal film is a porous-like structure thatis formed by depositing a metal in a particle state.

Advantageous Effects of the Invention

According to the present invention, a production method can be providedthat achieves fine patterning of a wiring circuit and a reduction incost, and enables production of a three-dimensional wiring board thatprevents disconnection of wires in a wiring circuit and thus hasexcellent reliability. Further, according to the present invention,there can be provided a three-dimensional wiring board with respect towhich fine patterning of a wiring circuit and a reduction in cost areachieved, and that prevents disconnection of wires in a wiring circuitand thus has excellent reliability, as well as a substrate for athree-dimensional wiring board that is required for producing thethree-dimensional wiring board.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view illustrating a state during a processfor producing a three-dimensional wiring board according to an exampleof the present invention.

FIG. 2 is a cross-sectional view illustrating a state during a processfor producing the three-dimensional wiring board according to theexample of the present invention.

FIG. 3 is a schematic diagram illustrating a state during metal filmformation with respect to the three-dimensional wiring board accordingto the example of the present invention.

FIG. 4 is a cross-sectional view illustrating a state during a processfor producing the three-dimensional wiring board according to theexample of the present invention.

FIG. 5 is an enlarged conceptual diagram of a dashed-line region V inFIG. 4.

FIG. 6 is a schematic diagram illustrating a state during metal filmformation with respect to the three-dimensional wiring board accordingto the example of the present invention.

FIG. 7 is a schematic diagram illustrating a state during metal filmformation with respect to the three-dimensional wiring board accordingto the example of the present invention.

FIG. 8 is a schematic diagram illustrating a state during metal filmformation with respect to the three-dimensional wiring board accordingto the example of the present invention.

FIG. 9 is a cross-sectional view illustrating a state during a processfor producing the three-dimensional wiring board according to theexample of the present invention.

FIG. 10 is an enlarged conceptual diagram of a dashed-line region X inFIG. 9.

FIG. 11 is a schematic diagram illustrating a state during metal filmformation with respect to the three-dimensional wiring board accordingto the example of the present invention.

FIG. 12 is a cross-sectional view illustrating a state during a processfor producing the three-dimensional wiring board according to theexample of the present invention.

FIG. 13 is a schematic diagram illustrating a production processrelating to three-dimensional molding according to the example of thepresent invention.

FIG. 14 is a schematic diagram illustrating a production processrelating to three-dimensional molding according to the example of thepresent invention.

FIG. 15 is a schematic diagram illustrating a production processrelating to three-dimensional molding according to the example of thepresent invention.

FIG. 16 is a schematic diagram illustrating a production processrelating to three-dimensional molding according to the example of thepresent invention.

FIG. 17 is a cross-sectional view illustrating a state during a processfor producing the three-dimensional wiring board according to theexample of the present invention.

FIG. 18 is an enlarged conceptual diagram of a dashed-line region XVIIIin FIG. 17.

FIG. 19 is a cross-sectional view illustrating a state during a processfor producing the three-dimensional wiring board according to theexample of the present invention.

FIG. 20 is an enlarged conceptual diagram of a dashed-line region XX inFIG. 19.

FIG. 21 is a schematic diagram illustrating a state during metal filmformation with respect to the three-dimensional wiring board accordingto the example of the present invention.

FIG. 22 is a perspective view of the three-dimensional wiring boardaccording to the example of the present invention.

FIG. 23 is a schematic diagram illustrating a usage example of thethree-dimensional wiring board according to the example of the presentinvention.

MODE FOR CARRYING OUT THE INVENTION

Hereunder, with reference to the accompanying drawings, a mode forcarrying out the present invention is described in detail based on anexample. Note that the present invention is not limited to the contentsdescribed below and can be optionally modified and implemented within arange that does not depart from the gist of the present invention.Further, the respective drawings that are used for the description ofthe example schematically illustrate a three-dimensional wiring board aswell as constituent members thereof according to the present invention,and in some cases, to deepen understanding of the present invention, thethree-dimensional wiring board and the constituent members thereof arepartially emphasized, enlarged, reduced, or omitted or the like, andthus the drawings do not exactly represent the scale or shape or thelike of the three-dimensional wiring board and the constituent membersthereof. In addition, various numerical values used in the example aresometimes exemplary and can be modified in various ways as necessary.

Example

Hereunder, a three-dimensional wiring board production method accordingto an example of the present invention is described in detail referringto FIG. 1 to FIG. 22. FIG. 1, FIG. 2, FIG. 4, FIG. 9, FIG. 12, FIG. 17and FIG. 19 are cross-sectional views illustrating states during aprocess of producing a three-dimensional wiring board. FIG. 5 is anenlarged conceptual diagram of a dashed-line region V in FIG. 4. FIG. 10is an enlarged conceptual diagram of a dashed-line region X in FIG. 9.FIG. 18 is an enlarged conceptual diagram of a dashed-line region XVIIIin FIG. 17. FIG. 20 is an enlarged conceptual diagram of a dashed-lineregion XX in FIG. 19. In addition, FIG. 13 to FIG. 16 are schematicdiagrams illustrating a production process relating to three-dimensionalmolding according to an example of the present invention. Further, FIG.3, FIG. 6 to FIG. 8, FIG. 11 and FIG. 21 are schematic diagramsillustrating states during metal film formation with respect to athree-dimensional wiring board according to an example of the presentinvention. FIG. 22 is a perspective view of a three-dimensional wiringboard according to an example of the present invention.

First, as illustrated in FIG. 1, a thermoplastic resin film 1 isprepared (preparation step). For example, a known resin film such as apolyimide or polyethylene terephthalate film can be used as thethermoplastic resin film 1. The thickness of the thermoplastic resinfilm 1 is not limited and can be appropriately changed in accordancewith the intended use and required characteristics of thethree-dimensional wiring board. For example, in the case of using thethree-dimensional wiring board as a single unit, the thickness of thethermoplastic resin film 1 may be adjusted to approximately 100 μm(between 75 μm or more and 150 μm or less), while in the case of usingthe three-dimensional wiring board together with another retainingmember such as a mold resin, the thickness of the thermoplastic resinfilm 1 may be regulated to 50 μm or less.

Note that, the resin film that is prepared is not limited to athermoplastic type of resin, and as long as the resin film has acomparatively large breaking elongation, a thermosetting resin film or acomposite resin film which has a structure in which a thermosettingresin and a thermoplastic resin are laminated (that is, a thermoplasticresin film and a thermosetting resin film are bonded together) may beused. Here, the term “comparatively large breaking elongation” refers toa value of at least 50% or more, and preferably a value of 150% or more.With respect to the breaking elongation, in a case where necessarycharacteristics are required in accordance with a three-dimensionalshape that is to be molded, and the resin film has a complex and largestepped shape, resin film material having a larger breaking elongationstrength is required so that the material can withstandthree-dimensional molding.

Next, as illustrated in FIG. 2, to secure conductivity between the frontand rear faces (first face 1 a and second face 1 b) of the thermoplasticresin film 1, a through-hole 2 is formed using a hole-forming techniquesuch as NC machining, laser machining or a punching process. In thepresent example, the diameter of the through-hole 2 is madeapproximately 0.3 mm. Note that, although only one through-hole 2 isillustrated in FIG. 2, the actual three-dimensional wiring board has aplurality of the through-holes 2. Further, the quantity of thethrough-holes 2 can be changed appropriately in accordance with thecircuitry of the three-dimensional wiring board. In addition,positioning holes (for example, with a diameter of 3 mm) to be used forpositioning during three-dimensional molding that is described later maybe formed at an outer edge portion (that is, a portion that is to beultimately removed without constituting the three-dimensional wiringboard) of the thermoplastic resin film 1.

Next, a first metal film 3 is formed on the surface of the thermoplasticresin film 1 (first metal film formation step) so as to cover the firstface 1 a and second face 1 b of the thermoplastic resin film 1 as wellas a side face 1 c of the thermoplastic resin film 1 that is exposed bythe through-hole. In the present example, metal is metallized on thesurface of the thermoplastic resin film 1 by electroless platingutilizing a known molecular bonding technique.

More specifically, first, as a pretreatment, Argon plasma treatment isperformed on the thermoplastic resin film 1 to remove a fragile layer ofthe surface of the thermoplastic resin film 1 and form functional groupshaving good affinity for a molecular bonding agent, described later, onthe surface of the thermoplastic resin film 1. Thereafter, thethermoplastic resin film 1 that underwent the Argon plasma treatment isimmersed in a liquid solution of a molecular bonding agent 4 (FIG. 3).In this case, because the molecular bonding agent 4 has a functionalgroups (first functional groups) that react with the thermoplastic resinfilm 1, the functional groups of the thermoplastic resin film 1 and thefunctional groups of the molecular bonding agent 4 join together and, asillustrated in FIG. 4 and FIG. 5, a state is obtained in which themolecular bonding agent 4 is bonded onto the surface of thethermoplastic resin film 1. Note that, although in FIG. 4 the molecularbonding agent 4 is illustrated in a layered state from the viewpoint ofillustrating the molecular bonding agent 4 in an easily comprehensiblemanner, in practice the molecular bonding agent 4 is present in anano-level state (the thickness of the molecular bonding agent 4 isseveral nm) as shown in FIG. 5, and is extremely thin in comparison tothe other material. Hence, the molecular bonding agent 4 is sometimesomitted from the drawings from FIG. 9 onwards. Further, straight linesthat extend vertically from the molecular bonding agent 4 in FIG. 5represent functional groups. More specifically, straight lines thatextend towards the thermoplastic resin film 1 represent functionalgroups of the molecular bonding agent 4 that are in a state in which thefunctional groups are joined together with functional groups of thethermoplastic resin film 1, and straight lines that extend on theopposite side to the side of the thermoplastic resin film 1 representfunctional groups of the molecular bonding agent 4 that react with ametal of the first metal film 3.

Next, after being subjected to the molecular bonding process, thethermoplastic resin film 1 is immersed in a catalyst solution (Sn—Pdcolloid aqueous solution) (FIG. 6). In this case, the Sn—Pd colloids areelectrically adsorbed on the surface of the thermoplastic resin film 1.Thereafter, when the thermoplastic resin film 1 that is in a state inwhich Sn—Pd colloids are supported on the surface thereof is impregnatedwith an accelerator solution, the Sn that had been covering thecircumference of the Pd is removed, and the Pd ions change to metallicPd (FIG. 7). That is, a catalytic treatment is performed to cause thethermoplastic resin film 1 to carry a catalyst (for example Pd). Notethat sulfuric acid (concentration of 10%) containing oxalic acid (around0.1%) can be used as the accelerator solution. Thereafter, thethermoplastic resin film 1 carrying the Pd as a catalyst is immersed forfive minutes in an electroless plating bath. By means of theaforementioned immersion, for example copper is deposited using Pd as acatalyst, and the deposited copper bonds with the molecular bondingagent 4 (FIG. 8). In this case, because the molecular bonding agent 4also has functional groups (second functional groups) that react withthe metal of the first metal film 3, utilizing the catalyst, the metalchemically bonds to the ends (second functional groups) of the molecularbonding agent 4 that are positioned on the opposite side to the endsthat are bonded to the thermoplastic resin film 1. Next, thethermoplastic resin film 1 is subjected to a heating treatment at 150°C. for 10 minutes to conclude the chemical bonding between the molecularbonding agent 4 and the metal, and thereby complete formation of thefirst metal film 3 (that is, molecular bonding between the thermoplasticresin film 1 and the first metal film 3) so as to cover the surface ofthe thermoplastic resin film 1 as illustrated in FIG. 9.

The aforementioned molecular bonding agent 4 is a chemical substance forchemically bonding resin and metal or the like, and is a substance inwhich a functional group that bonds with resin and a functional groupthat bonds with metal are present in a single molecular structure.Further, the term “molecular bonding technique” refers to a techniquethat chemically bonds resin and metal using the molecular bonding agent4 that has the aforementioned structure. The molecular bonding agent andthe molecular bonding technique are described in more detail in thedescription of Japanese Patent No. 4936344, the description of JapanesePatent No. 5729852, and the description of Japanese Patent No. 5083926.

In the present example, copper is used as the metal of the first metalfilm 3, and as illustrated in FIG. 10, in the electroless plating thefirst metal film 3 is formed in a porous state by particles 3 a of thecopper that is generated in a particle state. Here, the term “porousstate” refers to a state in which, although the first metal film 3 doesnot have a film thickness that is formed completely over the resin film,the film overall is conductive as a result of at least some of theparticles coming in contact with each other even though not all of theparticles contact with other particles (electrical conduction is notnecessarily needed, and even if particles are separated by aninter-particle distance in three-dimensional molding, it is sufficientas long as conduction is ensured by a second metal film that isdescribed later). To paraphrase the foregoing description, in thepresent example, copper is deposited in a particle state with theparticles having a size between 0.02 μm and 0.20 μm to form the firstmetal film 3 that has a film thickness which can transmit light. Thereason for regulating the state (that is, the film thickness) of thefirst metal film 3 in this manner is that if the first metal film 3 isformed in a complete film state which does not transmit light, iffissures arise in the first metal film 3 at the time ofthree-dimensional molding that is described later, it will be difficultto repair the fissures by means of a second metal film that is describedlater. More specifically, if the first metal film 3 is thinner than 0.02μm, contact points between the resin and copper will decrease and theadherence will be reduced, and the inter-particle distance after beingstretched will be too long and repairing conductivity by means of thesecond metal film that is described later will be difficult. Further, ina case where the first metal film 3 is stretched in a state in which thefirst metal film 3 transmits light, the fissures are small since onlythe spaces between the particles are empty. However if the metal film(the first metal film 3) is stretched beyond the limit in a completefilm state that does not transmit light, fissures will arise in themetal film and will become cracks that have a wide width. Note that,although only one particle 3 a is present in the film thicknessdirection of the first metal film 3 in the illustration in FIG. 10, aslong as the first metal film 3 is in a porous state, a plurality of theparticles 3 a may be stacked in the film thickness direction.

The process of forming the first metal film 3 in a porous state isdescribed in more detail hereunder. When deposition of copper continuesfurther from the state in which deposition of copper started that isillustrated in FIG. 8, the newly deposited copper chemically bonds withthe molecular bonding agent 4 or with copper that already deposited andreacted with the molecular bonding agent 4. At such time, because theactivity of Pd as a catalyst is higher, although generation of thecopper proceeds in the planar direction (that is, the direction in whichthe surface of the thermoplastic resin film 1 extends) by autocatalysisof copper, generation of copper also begins to proceed in the thicknessdirection (that is, the thickness direction of the first metal film 3).Further, when the autocatalysis of copper starts, copper is sequentiallydeposited and metallic bonding between copper molecules proceeds, andthus the growth of copper proceeds in the thickness direction and thefilm thickness thereby increases. In this state, as illustrated in FIG.11, although there are void portions at which copper is not present andportions at which electrical conduction is not obtained partially exist,because electrical connection paths are present, electrical conductionis obtained with respect to the overall metal film that is formed. Asdescribed above, such a state is referred to as a “porous state” in thepresent example. Further, in the first metal film 3 that is in such aporous state, even if the breaking elongation rate of copper isexceeded, the distances between copper molecules merely increase by acertain extent in parts of the first metal film 3 without large cracksarising.

Further, in the present example, because the thermoplastic resin film 1and the first metal film 3 chemically bond through the molecular bondingagent 4, both members can be firmly joined together while making theinterface between the thermoplastic resin film 1 and the first metalfilm 3 smooth. Consequently, it is no longer necessary to formconcavities and convexities on the surface of the thermoplastic resinfilm 1, and it is possible to simplify the production process and reducethe production cost and also increase the fineness of a wiring circuitthat is formed. Note that the molecular bonding agent that is used isnot limited to a single kind. For example, the molecular bonding agentmay be a chemical compound that is formed by mixing the molecularbonding agent 4 and another molecular bonding agent having functionalgroups that react with the molecular bonding agent 4 and the first metalfilm 3, and can be appropriately changed according to the material ofthe thermoplastic resin film 1 and the first metal film 3.

Further, the material of the first metal film 3 is not limited tocopper. For example, although various metals such as silver, gold ornickel, or an alloy including at least any one of these metals andcopper, or a material obtained by laminating respective metals may alsobe used, preferably a metal that is comparatively soft and has a highdegree of breaking elongation strength is used. In this respect, since afilm thickness for realizing a state that transmits light and isconductive will differ depending on the metal that is used, in the caseof using a different metal, the film thickness is appropriately adjustedso that the first metal film 3 can be formed in a porous state.

In addition, the method for forming the first metal film 3 is notlimited to the aforementioned method using a molecular bondingtechnique, and for example a film deposition technique such assputtering, vapor deposition, or wet plating that is other than a methodusing molecular bonding may be used as long as the first metal film 3can be formed in a porous state. Further, with respect to formation ofthe first metal film 3, the optimal film deposition technique may beselected in accordance with the metal material to be used.

Note that, although in the present example the first metal film 3 isformed so as to cover the first face 1 a and the second face 1 b of thethermoplastic resin film 1 as well as the side face 1 c of thethermoplastic resin film 1 that is exposed by a through-hole, dependingon the required structure and characteristics of the three-dimensionalwiring board, the first metal film 3 may be formed on only either one ofthe first face 1 a and the second face 1 b of the thermoplastic resinfilm 1. That is, a three-dimensional wiring board on which a wiringpattern is formed on only one side is also included as athree-dimensional wiring board according to the present invention, andnot just a three-dimensional wiring board on which a wiring pattern isformed on both sides.

Next, as illustrated in FIG. 12, a patterning process in performed onthe first metal film 3 by photolithography to thereby form a desiredwiring pattern (pattern formation step). Specifically, a resist film isbonded by thermocompression bonding to the surface of the thermoplasticresin film 1 in a state in which the first metal film 3 is formedthereon, and exposure and development are performed using a mask film onwhich a predetermined pattern is printed. Subsequently, the first metalfilm 3 is subjected to etching using the developed resist film as anetching mask, thereby forming a desired wiring pattern. Thereafter, theresist film is detached and removed. Here, in consideration ofstretching and deformation of the first metal film 3 caused bythree-dimensional molding that is described later, it is preferable toadjust the shape of the wiring pattern (line width, wiring length,wiring interval and the like) in advance.

Because patterning is performed on the first metal film 3 byphotolithography in this manner, a pattern with a higher definition canbe realized in comparison to pattern formation using an inkjet printingtechnique or a gravure offset printing technique. That is, theresolution of the first metal film 3 is higher than that of a wiringpattern that is patterned using an inkjet printing technique or agravure offset printing technique or the like (that is, high-definitionwiring formation is realized that has excellent linearity).

Next, a heat treatment and pressurization treatment are performed on thethermoplastic resin film 1 in a state in which the first metal film 3 isformed thereon to thereby perform three-dimensional molding(three-dimensional molding step). As a specific three-dimensionalmolding step, first, positioning of the thermoplastic resin film 1 withrespect to a casting mold 11 is performed using the aforementionedpositioning holes. This is done to align the molding position and thewiring pattern position. That is, as illustrated in FIG. 13, thethermoplastic resin film 1 is disposed between an upper mold 12 and alower mold 13 of the mold 11. Next, as illustrated in FIG. 14, the uppermold 12 is heated by an upper heating apparatus 14, and the lower mold13 is heated by a lower heating apparatus 15. At this time, the heatingtemperature can be regulated within a range of 270 to 350° C. (forexample, 300° C.) that is higher than the glass transition temperatureof the material in the present example because a polyimide film is usedas the thermoplastic resin film 1, and the heating temperature isappropriately regulated according to the material of the thermoplasticresin film 1. In this case, although it is necessary for the heatingtemperature to be equal to or higher than the relevant glass transitiontemperature and to be less than or equal to the heat-resistanttemperature of the thermoplastic resin film 1, the heating temperatureis preferably set to as low a temperature as possible within therelevant range. This is done to lessen a reduction in adherence betweenthe thermoplastic resin film 1 and the first metal film 3 formed on thethermoplastic resin film 1 that is caused by the heating.

While performing the heat treatment, the upper mold 12 and the lowermold 13 are brought close to each other to perform a pressing processusing a desired pressure (for example, 10 MPa) from above and below onthe thermoplastic resin film 1 (FIG. 15). Note that the desired pressureis appropriately adjusted in consideration of the material of thethermoplastic resin film 1 and the fact that it will be difficult toperform the desired three-dimensional molding if the pressure is tooweak. After the pressing process ends, the thermoplastic resin film 1 istaken out from the mold 11 (FIG. 16), thereby completing thethree-dimensional molding of the thermoplastic resin film 1. In otherwords, the formation of a substrate for a three-dimensional wiring board16 is completed. Note that illustration of the first metal film 3 isomitted in the drawings from FIG. 13 to FIG. 16. Further, although alsodepending on the three-dimensional shape that is required, because aplurality of concavities and convexities are formed in the shape of theactual three-dimensional wiring board, a structure having a plurality ofconcavities and convexities may also be adopted for the mold 11, inwhich the plurality of concavities and plurality of convexities of theupper mold 12 and the lower mold 13 fit together.

As illustrated in FIG. 17, in the thermoplastic resin film 1 aftercompletion of the three-dimensional molding (that is, the substrate fora three-dimensional wiring board 16), fissures 17 are liable to arise atbent portions 1 d that are bent by the three-dimensional molding. Inthis case, as illustrated in FIG. 18, the fissures 17 are gaps thatarise due to expansion of an inter-particle distance between theparticles 3 a of the copper constituting the first metal film 3, and thestructure of the fissures 17 differs from the structure of fissures thatarise due to a metal film being stretched in a complete metal film shapethat does not transmit light. Note that, depending on the depositionstate of the first metal film 3 and the three-dimensional shape obtainedby three-dimensional molding, the fissures do not arise in some cases.Further, as illustrated in FIG. 18, although the inter-particle distancein the first metal film 3 widens in accordance with stretching of thethermoplastic resin film 1, because the first metal film 3 is formed ina porous state, the depth of the fissures 17 is equal to the dimensionsof the particles 3 a and is thus extremely small, and in addition, thewidth of the fissures 17 is also small in comparison to a case where thefirst metal film 3 is formed in a complete film state. That is, thesubstrate for a three-dimensional wiring board 16 according to thepresent example is in a state that enables easier repair of the fissures17 in comparison to a case where the first metal film 3 is formed in acomplete film state. In other words, although in a case where the firstmetal film 3 is stretched in a state in which the first metal film 3transmits light, the fissures 17 (gaps between particles) are smallsince the spaces between particles are merely empty, in a metal filmthat is stretched beyond the limit in a complete film state that doesnot transmit light, fissures arise and cracks which have a wide widthare generated.

Further, as a method for reducing the occurrence of the fissures 17 atthe bent portion 1 d, the above described three-dimensional molding maybe performed in a state in which the thermoplastic resin film 1 isinterposed between two protective films. By this means, the shape ofangular parts 1 e of the bent portions 1 d can be smoothened to acertain extent and the occurrence of the fissures 17 can be suppressed.In this case, the protective films are preferably formed of the samematerial as the thermoplastic resin film 1. In addition, as a method forreducing the occurrence of the fissures 17 at the bent portions 1 d, themold 11 may be designed so as to cause the shape of the angular parts 1e of the bent portions 1 d to curve, or so as to make the angle of theangular parts 1 e less than 90 degrees (for example, 75 to 85 degrees).

Note that, although in the present example a pressing process isperformed on the thermoplastic resin film 1 from above and below usingthe upper mold 12 and the lower mold 13, another pressing method such asvacuum pressing or air-pressure pressing may be used as long asuniformity of the thickness of the thermoplastic resin film 1 afterheat-pressing can be ensured.

Next, a second metal film 21 is formed so as to cover the surface of thefirst metal film 3 of the substrate for a three-dimensional wiring board16 (second metal film formation step: FIG. 19). In the present example,metal is additionally deposited on the surface of the first metal film 3by common electroless plating.

Specifically, in the second metal film formation step, first, in orderto remove an oxidized layer that was formed on the surface of thesubstrate for a three-dimensional wiring board 16 by heating in themolding step, the substrate for a three-dimensional wiring board 16 isimmersed in a desired cleaning solution (for example, an acid-degreasingsolution or sulfuric acid solution). Next, a catalytic treatment isperformed to cause a catalyst (for example, a Pd catalyst) of a typethat replaces the first metal film 3 to react with the first metal film3 of the substrate for a three-dimensional wiring board 16, andthereafter the substrate for a three-dimensional wiring board 16 isimmersed in an electroless plating solution. Subsequently, metal isselectively deposited at only a region surrounding the first metal film3 that has the catalyst present on the surface thereof, and metal is notdeposited at regions which do not form a wiring circuit (that is,exposed regions of the thermoplastic resin film 1) and at whichadditional patterning of the second metal film 21 is not required.

In the present example, copper is used as the metal of the second metalfilm 21, and as will be understood from FIG. 20 and FIG. 21, a pluralityof particles 21 a of copper are deposited on the particles 3 a of thefirst metal film 3. In this case, the second metal film 21 is formed ina complete film state, and not a porous state. In particular, in thepresent example, the second metal film 21 having a thickness of 5 μm ormore can be formed by immersion for one hour. Further, in the presentexample, the particles 21 a constituting the second metal film 21 growaround the particles 3 a constituting the first metal film 3, and growto the same extent in both the thickness direction of the second metalfilm 21 and a direction that is orthogonal to the thickness direction(planar direction of the second metal film 21). By this means, thesecond metal film 21 can be formed so as to repair the fissures 17 inthe first metal film 3 that are generated by the three-dimensionalmolding. That is, by forming the second metal film 21, conductionfailures caused by the fissures 17 are repaired and a wiring circuit(conductor layer consisting of the first metal film 3 and the secondmetal film 21) can be formed. In this case, since repairing of thefissure 17 by the second metal film 21 can repair a width of the fissure17 that is of the order of twice the film thickness of the second metalfilm 21, the film thickness of the second metal film 21 may be regulatedto a thickness that is equal to or greater than one-half of the assumedmaximum width of the fissure 17, and more preferably may be regulated toa film thickness that is equal to the width of the fissure 17. Further,the second metal film 21 is generated in a similar manner to the surfacelayer on a side wall 1 c of a through-hole 2 also, and even if aconduction failure exists between the front and rear faces that iscaused by the through-hole 2, it is thereby possible to repair thefailure and restore conduction.

In addition, in the present example, although the thickness of theconductor layer (wiring pattern thickness) that is necessary as a wiringcircuit is insufficient when only the film thickness of the first metalfilm 3 is present, the necessary thickness of the conductor layer can besecured by forming the second metal film 21.

Note that, although in the present example the second metal film 21 isformed by electroless plating, as long as the second metal film 21 canultimately be formed only on the surface of the first metal film 3,another film deposition technique (for example, electroplating orcoating of conductive ink) may be used. However, although in the case offorming the second metal film 21 by electroless plating as in thepresent example it is possible to form independent wiring, that is, awiring circuit that is electrically isolated from the outercircumferential portion of the molded body, in the case of forming thesecond metal film 21 by electroplating it is necessary for all of thewiring to be electrically conductive with the outer circumferentialportion of the molded body, and hence it is necessary to take this intoconsideration including the arrangement of the power feeder lines duringthe design stage. Further, in this case, if a non-conducting portionarises as a result of performing three-dimensional molding, it will notbe possible to form the second metal film 21 because electricity willnot flow further then the non-conducting portion.

Note that the material of the second metal film 21 is not limited tocopper, and another metal such as nickel, nickel-chromium,nickel-copper, gold or silver or alloys which include these metals maybe used, and the material can be appropriately adjusted in accordancewith the characteristics and reliability that are required of thethree-dimensional wiring board.

After the above described production process is performed, the surfaceof the second metal film 21 is subjected a rust prevention treatment tothereby complete production of a three-dimensional wiring board 30 thatis constituted by the thermoplastic resin film 1, the first metal film 3and the second metal film 21. Note that a protective film made of solderresist may also be formed at required portions on the surface of thethree-dimensional wiring board 30. In this case, a method is conceivablein which the solder resist is applied onto required portions by aninkjet method that uses an inkjet device.

As will be understood from FIG. 19 to FIG. 21, in the three-dimensionalwiring board 30 according to the present example, fissures that arise inthe first metal film 3 that is formed in a porous state on the surfaceof the thermoplastic resin film 1 are surely repaired by the secondmetal film 21 that is formed having a film thickness that is thickerthan the thickness of the first metal film 3, and thus thethree-dimensional wiring board 30 is a wiring board which preventsdisconnection of wires in a wiring circuit and has excellentreliability. Further, in comparison to an MID substrate, a fine wiringpattern (for example, L/S=30/30 μm) can be realized more easily by theabove described production method, and miniaturization and lower costsare also realized by the above described production method.

Furthermore, as illustrated in FIG. 22, in the three-dimensional wiringboard 30 that is ultimately formed, dimensions in the z-direction (thatis, a height dimension) differ at positions in the x-direction andy-direction, respectively, and concavities and convexities are formed onthe x-y plane. Note that FIG. 22 is a schematic drawing for describingthe three-dimensional shape of the three-dimensional wiring board 30,and a wiring pattern and a through-hole are omitted from theillustration in FIG. 22.

In addition, because the three-dimensional wiring board according to thepresent example has a conductor layer constituted by the first metalfilm 3 and the second metal film 21 on the surface (first face 1 a andsecond face 1 b) of the thermoplastic resin film 1, and also has athree-dimensional shape, the three-dimensional wiring board 30 can beapplied to various uses. For example, if the thermoplastic resin film 1is made comparatively thick (for example, 100 μm), as illustrated inFIG. 23, it is possible to mount another electronic component 42 on thesurface of the thermoplastic resin film 1 while achievingelectromagnetic shielding with respect to an electronic component 41that is mounted on another mounting board 40. In this case, sinceelectromagnetic shielding is achieved by means of the conductor layer(the first metal film 3 and the second metal film 21) located on theelectronic component 41 side (that is, the inner side), patterning isnot performed on the conductor layer that is located on the inner side(that is, a solid pattern is formed). Further, the three-dimensionalwiring board 30 is adhered to the mounting board 40 using a bondingmember such as a solder or an electroconductive adhesive. Note that, byreplacing the conductor layer that is patterned with a conductor layerthat is not patterned, a configuration may be adopted in which theelectronic component 42 is disposed in a space that is shielded by thethree-dimensional wiring board 30 and the mounting board 40, andelectromagnetic shielding is achieved with respect to the electroniccomponent 41 and the electronic component 42.

In addition, the conductor layer on which patterning has not beenperformed may be grounded and caused to function as a GND layer, and anindependent characteristic impedance control pattern or a differentialimpedance control pattern may be formed on the conductor layer locatedon an opposite side to the conductor layer on which patterning has notbeen performed. Due to this structure, impedance control can be achievedin the three-dimensional wiring board 30.

Further, in a case where the thermoplastic resin film 1 is madecomparatively thin (for example, 50 μm or less), the three-dimensionalwiring board 30 can be bonded to another mold resin having athree-dimensional shape and can be used as a composite structure thatserves as a substitute for a conventional MID substrate. This isbecause, since the thermoplastic resin film 1 is thin, even if thethree-dimensional wiring board 30 is adhesively bonded to another moldresin, the thickness of the composite structure constituted by thethree-dimensional wiring board 30 and the other mold resin is not large,and the strength as the composite structure in question can be secured.Further, because a conductor layer is formed on both sides of thethermoplastic resin film 1, a degree of freedom in the design and anarrowing of the external size of the composite structure in questioncan be easily achieved in comparison to the conventional MID substrate.

Further, by adopting a structure in which a flat thermoplastic resinfilm joins two portions that were three-dimensionally molded, andforming wiring that links the two portions, a variety of structures andusage methods for a so-called “flex-rigid board” are obtained.

Embodiments of the Present Invention

A three-dimensional wiring board production method according to a firstembodiment of the present invention includes: a preparation step ofpreparing a resin film having a breaking elongation of 50% or more (afilm that is actually used is a thermoplastic polyimide material havinga thickness of 125 μm that has a breaking elongation of 160 to 170%); afirst metal film formation step of forming a first metal film on asurface of the resin film; a pattern formation step of performingpatterning on the first metal film by photolithography to form a desiredpattern; a three-dimensional molding step of performingthree-dimensional molding by heating and pressurizing the resin film;and a second metal film formation step of forming a second metal film onthe first metal film having a pattern formed thereon; wherein, in thefirst metal film formation step, the first metal film is formed in aporous state by depositing a metal in a particle state and regulating afilm thickness.

In the first embodiment, because the second metal film is formed usingthe first metal film on which a pattern is formed, a special apparatusor process or the like is not required to perform patterning on thefirst metal film and the second metal film, and an existing wiring boardproduction apparatus can be used, and a finer wiring pattern can berealized at a lower cost. Further, because the first metal film and thesecond metal film are formed on both sides of the resin film, incomparison to a single-sided substrate, the degree of freedom of thewiring circuit is greater and it is also possible to achieveminiaturization more easily. In addition, because the first metal filmis formed in a porous state, the occurrence of irreparable fissures inthe first metal film can also be prevented in the subsequentthree-dimensional molding step. Thus, the three-dimensional wiring boardproduction method of the present invention can achieve fine patterningof a wiring circuit and cost reductions, and can produce athree-dimensional wiring board that prevents disconnection of wires in awiring circuit and thus has excellent reliability.

A three-dimensional wiring board production method according to a secondembodiment of the present invention is in accordance with theaforementioned first embodiment, wherein, in a case where a fissurearises in the first metal film that is located on a bent portion of theresin film that is bent by three-dimensional molding in thethree-dimensional molding step, the fissure is repaired by means of thesecond metal film. By this means, a highly reliable three-dimensionalwiring board in which a conduction failure does not arise in a wiringcircuit can be produced.

A three-dimensional wiring board production method according to a thirdembodiment of the present invention is in accordance with theaforementioned second embodiment, wherein, a thickness of the secondmetal film in the second metal film formation step is made a thicknessthat is equal to or greater than one-half of a width of the fissure. Bythis means, a fissure that arises in the first metal film can be surelyrepaired by the second metal film.

A three-dimensional wiring board production method according to a fourthembodiment of the present invention is in accordance with any one of theabove described first to third embodiments, wherein, in the first metalfilm formation step, copper, silver, nickel or gold, or an alloyincluding at least any one of copper, silver, nickel and gold isdeposited in a particle state at a thickness within a range from 0.02 μmto 0.20 μm. By this means, a fissure that arises in the first metal filmcan be reduced without impairing the adherence between the resin andmetal, and the fissure can be surely repaired by the second metal film.

A three-dimensional wiring board production method according to a fifthembodiment of the present invention is in accordance with any one of theabove described first to fourth embodiments, wherein, in the first metalfilm formation step, the resin film and the first metal film arechemically bonded using a molecular bonding agent. By this means, theresin film and the first metal film can be surely bonded togetherwithout forming concavities and convexities in the resin film, and areduction in the production cost and an increase in the fineness of thewiring pattern can be achieved.

A three-dimensional wiring board production method according to a sixthembodiment of the present invention is in accordance with the abovedescribed fifth embodiment, wherein the molecular bonding agent includesa first functional group that reacts with the resin film and a secondfunctional group that reacts with a metal of the first metal film. Bythis means, the resin film and the first metal film can be bondedtogether more surely, and a further reduction in the production cost canbe achieved.

A three-dimensional wiring board production method according to aseventh embodiment of the present invention is in accordance with anyone of the above described first to sixth embodiments, wherein, in thefirst metal film formation step the first metal film is formed on bothsides of the resin film, in the pattern formation step patterning isperformed on each of the first metal films that are formed on both sidesof the resin film, and in the second metal film formation step thesecond metal film is formed on each of the first metal films which eachhave a pattern formed thereon. By this means, a wiring pattern can beformed on both sides of the three-dimensional wiring board, and highdensification of the three-dimensional wiring board can be achieved.

A three-dimensional wiring board according to an eighth embodiment ofthe present invention includes: a resin film having a three-dimensionalshape and having a breaking elongation of 50% or more; a first metalfilm that is formed on a surface of the resin film and that has adesired pattern; and a second metal film that is formed on the firstmetal film; wherein a film thickness of the first metal film isregulated so that the first metal film is a porous-like structure thatis formed by depositing a metal in a particle state.

In the eighth embodiment, because the second metal film is formed usingthe first metal film having a pattern formed thereon, a specialapparatus or process for performing patterning on the first metal filmand the second metal film is not required, and a lower cost and finerwiring pattern is realized. Further, because the first metal film andthe second metal film are formed on both sides of the resin film, incomparison to a single-sided substrate, the degree of freedom withrespect to a wiring circuit is greater and it is possible to easilyachieve miniaturization. In addition, because the first metal film isformed in a porous state, even if fissures arise in the first metalfilm, the fissures are repaired by the second metal film, and thus awiring circuit having no conduction failures and excellent reliabilityis realized. Thus, the three-dimensional wiring board of the presentinvention achieves fine patterning of a wiring circuit and a reductionin cost, and prevents the disconnection of a wire in a wiring circuitand hence has excellent reliability.

A three-dimensional wiring board according to a ninth embodiment of thepresent invention is in accordance with the above described eighthembodiment, wherein the second metal film repairs a fissure that arisesin the first metal film at a bent portion of the resin film. By thismeans, a conduction failure does not occur in the wiring circuit, andexcellent reliability can be realized.

A three-dimensional wiring board according to a tenth embodiment of thepresent invention is in accordance with the above described ninthembodiment, wherein a thickness of the second metal film is equal to orgreater than one-half of a width of the fissure. By this means, afissure that arises in the first metal film can be surely repaired bythe second metal film.

A three-dimensional wiring board according to an eleventh embodiment ofthe present invention is in accordance with any one of the abovedescribed eighth to tenth embodiments, wherein the first metal film hasa porous-like structure that is formed by depositing copper in aparticle state at a thickness within a range from 0.02 μm to 0.20 μm. Bythis means, fissures that arise in the first metal film can be madesmaller, and can be surely repaired by the second metal film.

A three-dimensional wiring board according to a twelfth embodiment ofthe present invention is in accordance with any one of the abovedescribed eighth to eleventh embodiments, the three-dimensional wiringboard including, between the resin film and the first metal film, amolecular bonding agent that chemically bonds the resin film and thefirst metal film. Therefore, since it is not necessary to formconcavities and convexities in the resin film, the production cost canbe reduced and the resin film and the first metal film can be firmlybonded together.

A three-dimensional wiring board according to a thirteenth embodiment ofthe present invention is in accordance with the above described twelfthembodiment, wherein the molecular bonding agent includes a firstfunctional group that reacts with the resin film and a second functionalgroup that reacts with a metal of the first metal film. By this means,the resin film and the first metal film can be bonded together morefirmly, and a further reduction in the production cost can be achieved.

A three-dimensional wiring board according to a fourteenth embodiment ofthe present invention is in accordance with any one of the abovedescribed eighth to thirteenth embodiments, wherein the first metal filmis formed on both sides of the resin film. By this means, highdensification of the three-dimensional wiring board can be achieved.

A substrate for a three-dimensional wiring board according to afifteenth embodiment of the present invention includes: a resin filmhaving a breaking elongation of 50% or more; and a first metal film thatis formed on a surface of the resin film and that has a desired pattern;wherein a film thickness of the first metal film is regulated so thatthe first metal film is a porous-like structure that is formed bydepositing a metal in a particle state.

In the fifteenth embodiment, because the first metal film is formed in aporous state, even if a fissure arises in the first metal film, thefissure can be repaired by deposition of an additional film, andtherefore the prevention of conduction failures is ultimately achieved.

A substrate for a three-dimensional wiring board according to asixteenth embodiment of the present invention is in accordance with theabove described fifteenth embodiment, including, between the resin filmand the first metal film, a molecular bonding agent that chemicallybonds the resin film and the first metal film. By this means, since itis not necessary to form concavities and convexities in the resin film,the production cost can be reduced and the resin film and the firstmetal film can be firmly bonded together.

A substrate for a three-dimensional wiring board according to aseventeenth embodiment of the present invention is in accordance withthe above described fifteenth or sixteenth embodiment, wherein the firstmetal film is formed on both sides of the resin film. By this means,high densification of the three-dimensional wiring board can beachieved.

EXPLANATION OF REFERENCE SIGNS

-   -   1 Thermoplastic Resin Film    -   1 a First Face    -   1 b Second Face    -   1 c Side Face    -   1 d Bent Portion    -   1 d Angular Part    -   2 Through-Hole    -   3 First Metal Film    -   3 a Particle    -   4 Molecular Bonding Agent    -   11 Mold    -   12 Upper Mold    -   13 Lower Mold    -   14 Upper Heating Apparatus    -   15 Lower Heating Apparatus    -   16 Substrate for Three-Dimensional Wiring Board    -   17 Fissure    -   21 Second Metal Film    -   21 a Particle    -   30 Three-Dimensional Wiring Board    -   40 Mounting Board    -   41 Electronic Component    -   42 Electronic Component

The invention claimed is:
 1. A three-dimensional wiring board productionmethod, comprising: a preparation step of preparing a resin film havinga breaking elongation of 50% or more; a first metal film formation stepof forming a first metal film on a surface of the resin film; a patternformation step of performing patterning on the first metal film byphotolithography to form a desired pattern; a three-dimensional moldingstep of performing three-dimensional molding by heating and pressurizingthe resin film; and a second metal film formation step of forming asecond metal film on the first metal film having a pattern formedthereon; wherein, in the first metal film formation step, the firstmetal film is formed in a porous state by depositing a metal in aparticle state and regulating a film thickness.
 2. The three-dimensionalwiring board production method according to claim 1, wherein, in thesecond metal film formation step, in a case where a fissure arises inthe first metal film that is located on a bent portion of the resin filmthat is bent by three-dimensional molding in the three-dimensionalmolding step, the fissure is repaired by means of the second metal film.3. The three-dimensional wiring board production method according toclaim 2, wherein, in the second metal film formation step, a thicknessof the second metal film is made a thickness that is equal to or greaterthan one-half of a width of the fissure.
 4. The three-dimensional wiringboard production method according to claim 1, wherein, in the firstmetal film formation step, copper, silver, nickel or gold, or an alloyincluding at least any one of copper, silver, nickel and gold isdeposited in a particle state at a thickness within a range from 0.02 μmto 0.20 μm.
 5. The three-dimensional wiring board production methodaccording to claim 1, wherein, in the first metal film formation step,the resin film and the first metal film are chemically bonded using amolecular bonding agent.
 6. The three-dimensional wiring boardproduction method according to claim 5, wherein the molecular bondingagent includes a first functional group that reacts with the resin filmand a second functional group that reacts with a metal of the firstmetal film.
 7. The three-dimensional wiring board production methodaccording to claim 1, wherein: in the first metal film formation step,the first metal film is formed on both sides of the resin film; in thepattern formation step, patterning is performed on each of the firstmetal films that are formed on both sides of the resin film; and in thesecond metal film formation step, the second metal film is formed oneach of the first metal films which each have a pattern formed thereon.